วันเสาร์ที่ 21 กันยายน พ.ศ. 2567

RBP Chemical Technology



จำหน่าย นำเข้าขาย ตัวแทนจำหน่าย จำหน่าย MicroClean EV3 (RDZ-1922) and ElectroPolish 2152

RBP Chemical Technology is the leader in development, manufacturing and the distribution of specialty chemical processes for the cleaning and passivation of implanted medical devices.
Solutions for cleaning, deoxidizing and polishing medical implant devices.
Find your material below to learn more about our processes and chemistry for medical implant devices.

Nitinol
Process Step Product Description
Step 1: Pre-Clean MicroClean™ Ti Degreaser+, designed to remove soils that could interfere with subsequent processes
Step 2: Deoxidize Ti Pickling Solution™ Mildly acidic, free of hydrofluoric acid
Step 2: Deoxidize MicroClean™ EV3 Strongly acidic, free of hydrofluoric acid
Step 2: Deoxidize MicroClean™ BS Strongly acidic, with hydrofluoric acid
Step 2: Deoxidize MicroPolish™ Strongly acidic, with hydrofluoric acid, inhibited, mild polishing action, relatively more aggressive
Step 2: Deoxidize MicroClean™ 2160 Moderately acidic, free of hydrofluoric acid
Step 2: Deoxidize MicroClean™ 2151 Moderately acidic, free of hydrofluoric acid
Step 2: Deoxidize MicroPolish™ II Strongly acidic, with hydrofluoric acid, inhibited, mild polishing action, relatively less aggressive
Step 2: Deoxidize MicroClean™ MV Strongly acidic, with hydrofluoric acid, inhibited, more aggressive
Step 2: Deoxidize, test MicroClean™ 2150 Moderately acidic, free of hydrofluoric acid
Step 3: Electropolish ElectroPolish NF™ Room temperature electropolishing chemistry, organic
Step 3: Electropolish Nitinol ElectroPolish™ Standard electropolish containing 70% Methanol/30% Sulfuric Acid; this product requires cooling to very low temperatures
Step 3: Electropolish ElectroPolish Ti2™ Room temperature electropolishing chemistry, organic
Step 3: Electropolish ElectroPolish 2152 Electropolish for Titanium and Titanium Alloys
Titanium Grade 5

Process Step Product Description
Step 1: Pre-Clean MicroClean™ Ti Degreaser+, designed to remove soils that could interfere with subsequent processes
Step 2: Deoxidize MicroClean™ 2160 Moderately acidic, free of hydrofluoric acid
Step 2: Deoxidize MicroClean™ 2151 Moderately acidic, free of hydrofluoric acid
Step 2: Deoxidize, test MicroClean™ 2150 Moderately acidic, free of hydrofluoric acid
Step 2: Deoxidize ChemPolish Ti6Al4V™ Strongly acidic, with hydrofluoric acid, inhibited
Step 3: Electropolish ElectroPolish NF™ Room temperature electropolishing chemistry, organic
Step 3: Electropolish ElectroPolish Ti2™ Room temperature electropolishing chemistry, organic
Step 3: Electropolish ElectroPolish 2152 Electropolish for Titanium and Titanium Alloys
Cobalt Chrome

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Process Step Product Description
Step 1: Pre-Clean MicroClean™ Ti Degreaser+, designed to remove soils that could interfere with subsequent processes
Step 2: Deoxidize CoCr Cleaner™ Strongly acidic, for light oxide
Step 2: Deoxidize CoCr Cleaner™ II
Step 2: Deoxidize Alkaline Descale™ A strongly oxidizing surface conditioner designed to descale cobalt/chromium and other chromium based alloys before chemical polishing or electropolishing
Step 2: Deoxidize Descale Remover™ An acidic chemistry that removes smut and residual metal oxide solubilized by Aklaline Descale
Step 3: Electropolish CoCr Electropolish Acidic electropolish chemistry
Stainless Steel

Tin Strippers
Product Description
M-Strip™ Peroxide-Based Tin/Lead Stripper
Magnum™ NPS-220 and Magnum™ NPS-240 Two Step, Non-Peroxide Solder Stripper
Select Strip™ Plus Whole panel stripper
NPS™ 3000 Single Step Tin Stripper
NPS™ 3001 Single Step Tin Stripper
NPS™ 3002 Enhanced Single Step Tin Stripper
NPS™10 & 20 Non-Peroxide Tin/Lead Stripper
Step Fourteen: Final Finishes
Final Finishes
Product Description
Aspect Organic Solderability Preservative
Chemposit Sn Immersion tin
Hot Air Leveling (HAL)/Reflow
Product Description
Acti Flo HAL flux
291 Flux HAL flux
Board Brite II Acid cleaner for tin
Solder Conditioner 417 Acid cleaner for tin
Thermo Flo™ Water-soluble fusing fluid
Quench Aide™ 96 Rinse agent
Rinse Aide™ 90 Cleaner
Rinse Aide™ 95 Cleaner
LevelCote™ Cover Oil 300 Solder blanket oil for HAL
LevelCote™ Flux 350 HAL flux
Flo Rite™ 60 HAL flux
Flo Rite™ LV HAL flux
Other
Commodity Chemicals
Product Description
Pure Isopropyl Alcohol colorless, flammable liquid with a characteristic alcohol odor
Acidified Pumice An Acidified Pumice Scrub
Copper Sulfate Solution Uses only sulfuric acid and pure copper metal
Hydrochloric Acid 20 Be Etching Solution
Sulfuric Acid 93% PC Grade PC (Printed Circuit) grade Sulfuric Acid
Waste Treatment
Product Description
MetalTreat Chelate Eliminator-8 Wastewater Treatment Chemical Formulation
Metaltreat 529 Heavy metal precipitant
Metaltreat 528 Coagulant Alternative to DTC Carbamate-type Products
Metaltreat 513 Heavy metal precipitant for wastewater treatment
Metaltreat 510 Ferrous Chloride based heavy metal precipitant
Metaltreat 4007 Wastewater treat coagulant
Metaltreat AF 13-10 Silicone based antifoam for waste treatment application
Metaltreat 958 Flocculant Unique high charge cationic flocculant
Metaltreat 957 Anionic Polymer Wastewater Flocculant
Metaltreat 530 Heavy metal precipitant
Resist Treat 5000 Wastewater coagulant/precipitant

Process Step Product Description
Step 1: Pre-Clean MicroClean™ Ti Degreaser+, designed to remove soils that could interfere with subsequent processes
Step 2: Clean ChemPolish™ RL Acidic chemistry for cleaning, polishing and passivating 300 series stainless steel
Step 2: Clean ChemPolish™ SS Acidic chemistry for polishing and passivating 300 series stainless steel
Step 3: Electropolish ElectroPolish 4000™
Step 3: Electropolish ElectroPolish 5000™ Acidic electropolish chemistry

Copper Cleaners
Product Description
FinClean RS Final Finish Acid Cleaner
FinClean CR Final Finish Acid Cleaner
VersaClean Metal Surface Cleaner for Electronics
Accuclean NF Acid cleaner for spray applications
Posiclean™ MR Acid cleaner for soak applications
Circutek™ ME-515 Microetchant for copper
Ultraclean™ NF Alkaline cleaner for spray applications
PrepBond™ Alkaline cleaner
Posiclean™ M Acid cleaner for soak applications
Layer Clean™ CR Acid cleaner for spray applications
Layer Clean™ NP Acid cleaner for spray applications
Step Two: Developing
Developers
Product Description
ADC-40 Developer concentrate
DX™45 HW Aqueous Developer Concentrate for Hard Water
DX™45 NH Aqueous Developer Concentrate
DX™45 Plus Enhanced Developer Replenisher
Step Three: Developing
PCB Antifoams
Product Description
Defoamer AR™ (RDZ-1969) Developer Antifoam
FoamFREE™ One Aqueous Developer/Stripper Antifoam
Defoamer FE™ Fully organic non-Silicone water-soluble defoamer
AntiFoam BB ™ Highly Concentrated Antifoam
Equipment Cleaners
Product Description
Citrisump Acidic equipment cleaner
Equipment Cleaner IV Equipment cleaner
Tidy Sump Equipment Cleaner
Sump Pro Non-chelating, acidic equipment cleaner
Sump Doctor™ Cleans resist developing and stripping machines
TidyLine™ EQ-100 Cleans conveyorized processing equipment
E-clean DF Acidic, solvent-based, soluble equipment cleaner
Equipment Cleaner II™ Equipment cleaner
Cupric Etching Equipment Cleaner Cupric Etching Equipment Cleaner
Step Four: Inner Layer Etching
Inner Layer Etching
Product Description
Hydrochloric Acid 20 Be Etching Solution
Sodium Chlorate 46% Etch Replenisher
Step Five: Inner Layer Resist Strip
Photoresist Strippers
Product Description
ADF-72 Aqueous Resist Stripper
ADF-55 Dry Film and Liquid Resist Stripper
Dual Strip™ BAT Resist and Ink Stripper
DX™ Strip BAT Resist and Ink Stripper
Step Six: Lamination
Lamination
Product Description
MagnaBond™ 400 Copper Surface Prep
Ultraclean™ NF Alkaline cleaner for spray applications
PrepBond™ Alkaline cleaner
Quantum Etch™ Microetchant for copper
MagnaBond™ CO-300 Copper Oxide Process
Step Seven: Desmear
PTH Desmear
Product Description
Magnum N-499 Peroxide Oxidizer for Neutralizer Magnum N-499
Magnum N-499 Neutralizer for Permanganate PTH Desmear
Magnum™ GE-600 Glass Etch
Magnum™ K-401 Oxidizer Permanganate desmear
Magnum™ N-501 Oxidizer Permanganate desmear
Magnum™ N-599 Neutralizer for permanganate desmear
Magnum™ S-400 Sweller
Magnum™ S-450 Sweller
Step Eight: Metallization
PTH Metalization
Product Description
Circutek EC-807 PTH Metallization Electroless Copper
Circutek C-877 Non-metallic Surface Catalyst
Circutek CC-720 Cleaner/Conditioner for Electroless Copper
Circutek CC-710 Conditioner for ElCu
Circutek C-777 Catalyst for ElCu
Circutek A-778 Accelerator for ElCu
Circutek PC-701 Electroless copper process
Circutek PD-776 Predip for ElCu catalyst
Circutek PC-801 Electroless copper process
Onyx Graphite Based Direct Metallization
Circutek™ ME-515 Microetchant for copper
Antitarnish
Product Description
AT-2000 Alkaline Oxidation Inhibitor Concentration
AT-3000 Concentrated antitarnish compound
Step Nine: Outer Layer
Copper Cleaners
Product Description
FinClean RS Final Finish Acid Cleaner
FinClean CR Final Finish Acid Cleaner
VersaClean Metal Surface Cleaner for Electronics
Accuclean NF Acid cleaner for spray applications
Posiclean™ MR Acid cleaner for soak applications
Circutek™ ME-515 Microetchant for copper
Ultraclean™ NF Alkaline cleaner for spray applications
PrepBond™ Alkaline cleaner
Posiclean™ M Acid cleaner for soak applications
Layer Clean™ CR Acid cleaner for spray applications
Layer Clean™ NP Acid cleaner for spray applications
Step Ten: Electrolytic Plating
Electrolytic Plating
Product Description
Cubrite CF-110 Plating additive for electrolytic copper
CuBrite™ PC-520 Plating additive for electrolytic copper
TinPlate™ PC-625 Plaing additive for electrolytic tin
CuBrite™ PC-525 Plating additive for electrolytic copper
Step Eleven: Outer Layer Resist Strippers
Outer Layer Resist Strippers
Product Description
ADF-25C Aqueous Photoresist Stripper Concentrate
ADF-72 Aqueous Resist Stripper
LDI Strip 77 Fine Line Resist Stripper
MicroStrip™ 2000 Fine Line Resist Stripper
Microstrip™ONE Fine Line Resist Stripper
Step Twelve: Outer Layer Etching
No Products Available from RBP
Step Thirteen: Tin Strippers
Tin Strippers
Product Description
M-Strip™ Peroxide-Based Tin/Lead Stripper
Magnum™ NPS-220 and Magnum™ NPS-240 Two Step, Non-Peroxide Solder Stripper
Select Strip™ Plus Whole panel stripper
NPS™ 3000 Single Step Tin Stripper
NPS™ 3001 Single Step Tin Stripper
NPS™ 3002 Enhanced Single Step Tin Stripper
NPS™10 & 20 Non-Peroxide Tin/Lead Stripper
Step Fourteen: Final Finishes
Final Finishes
Product Description
Aspect Organic Solderability Preservative
Chemposit Sn Immersion tin
Hot Air Leveling (HAL)/Reflow
Product Description
Acti Flo HAL flux
291 Flux HAL flux
Board Brite II Acid cleaner for tin
Solder Conditioner 417 Acid cleaner for tin
Thermo Flo™ Water-soluble fusing fluid
Quench Aide™ 96 Rinse agent
Rinse Aide™ 90 Cleaner
Rinse Aide™ 95 Cleaner
LevelCote™ Cover Oil 300 Solder blanket oil for HAL
LevelCote™ Flux 350 HAL flux
Flo Rite™ 60 HAL flux
Flo Rite™ LV HAL flux
Other
Commodity Chemicals
Product Description
Pure Isopropyl Alcohol colorless, flammable liquid with a characteristic alcohol odor
Acidified Pumice An Acidified Pumice Scrub
Copper Sulfate Solution Uses only sulfuric acid and pure copper metal
Hydrochloric Acid 20 Be Etching Solution
Sulfuric Acid 93% PC Grade PC (Printed Circuit) grade Sulfuric Acid
Waste Treatment
Product Description
MetalTreat Chelate Eliminator-8 Wastewater Treatment Chemical Formulation
Metaltreat 529 Heavy metal precipitant
Metaltreat 528 Coagulant Alternative to DTC Carbamate-type Products
Metaltreat 513 Heavy metal precipitant for wastewater treatment
Metaltreat 510 Ferrous Chloride based heavy metal precipitant
Metaltreat 4007 Wastewater treat coagulant
Metaltreat AF 13-10 Silicone based antifoam for waste treatment application
Metaltreat 958 Flocculant Unique high charge cationic flocculant
Metaltreat 957 Anionic Polymer Wastewater Flocculant
Metaltreat 530 Heavy metal precipitant
Resist Treat 5000 Wastewater coagulant/precipitant


 

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